STENCIL PER REBALLING IC CHIP ANDROID RELIFE RL-044 (Set 58pz)

STENCIL PER REBALLING IC CHIP ANDROID RELIFE RL-044 (Set 58pz)
Dima di precisione per rigenerazione, reballing, reflow, rework, dei CHIP IC CPU NAND BGA
su scheda madre

Compatibile per CPU
- Qualcomm Snapdragon 888/SM8350/845/SMD845/765G/SM7250/855/SM8150/865 large/SM8250-002/865 small/SM8250/8Gen1/SM8450/888/SM8350 Short-circuit proof isolation/780/775/SM7350/778G/SM7325/MSM8996/MSM8953 IAB/MS8953/SDM636/660/MSM8909/8905/SM6115/MSM8916/8939/MSM8937/8940/MSM8917/888+/SM8475/8Gen2/SM8550
- Dimensity 810/MT6833V/720/MT6853V/800/MT6873V/900/MT6877V/1000/MT6885Z/9000/MT6983Z/MT6769V/MT6582/110/1200/MT6891Z/6893Z/9200/MT6985W
- HiSilicon 710 HI6260/810 HI6280/690 HI3660/970 HI3670/980 HI3680/985/820 HI6290/L/990 HI3960 5G/Kirin 990/4G HI3690/9000 HI36A0
- BGA 134/153/162/178/211/254
- Hisilicon Qualcomm RAM upper layer/Kirin 9000 upper layer/Kirin 970/980/990 upper layer/Snapdradon 865+/870/888 upper layer
- Exynos 2200/9820/990/9815/1080/980/2100/8895

Design a foro quadrato
Reballi preciso e veloce
/Acciaio flessibile

Acciaio selezionato con elevata flessibilità e alta temperatura
Resistente, si comporta meglio del normale acciaio.
Fori Quadrati Con Angoli Arrotondati
Il foro quadrato non solo può rendere la saldatura di stagno più rotonda e paffuta, ma può anche impedire che esso si incastri nel foro dello stencil.

Appositamente progettato per i chip dei telefoni cellulari
Rende più agevole ogni operazione di reballing

- 1x EMMC1 BGA 134 T:0.15mm
- 1x EMMC2 BGA 153 T:0.15mm
- 1x EMMC3 BGA 162 T:0.15mm
- 1x EMMC4 BGA 178 T:0.15mm
- 1x EMMC5 BGA 211 T:0.15mm
- 1x EMMC6 BGA 254 T:0.15mm
- 1x ACU4 SNAPDRAGON 865 / 870 / 888 UPPER LAYER T:0.12mm
- 1x ACU3 UNICORN 970 / 980 / 990 UPPER LAYER T:012mm
- 1x ACU2 UNICORN 9000 UPPER LAYER T:0.12mm
- 1x ACU1 HISILICON QUALCOMM RAM UPPER LAYER T:0.12mm
- 1x EXC7 EXYNOS 8895 T:0.12mm
- 1x EXC6 EXYNOS 2100 T:0.12mm
- 1x EXC5 EXYNOS 980 T:0.12mm
- 1x EXC4 EXYNOS 9815 / 1080 T:0.12mm
- 1x EXC3 EXYNOS 990 T:0.12mm
- 1x ECX2 EXYNOS 9820 T:0.12mm
- 1x ECX1 EXYNOS 2200 T:0.12mm
- 1x MTC1 TIANJI 810 / MT6388V T:0.12mm
- 1x MTC2 TIANJI 720 / MT6853V T:0.12mm
- 1x MTC3 TIANJI 800 / MT6873V T:0.12mm
- 1x MTC4 TIANJI 900 / MT6877V T:0.12mm
- 1x MTC5 TIANJI 1000 / MT6858Z T:0.12mm
- 1x MTC6 TIANJI 9000 / MT6983Z T:0.12mm
- 1x MTC7 MT6769V T:0.12mm
- 1x MTC8 MT6762V T:0.12mm
- 1x MTC9 MT6582 T:0.12mm
- 1x MTC10 TIANJI 1100 / 1200 / MT6891Z / 6893Z T:0.12mm
- 1x MTC11 TIANJI 9200 / MT6985W T:0.12mm
- 1x HIC1 HISILICON 710 HI6260 T:0.12mm
- 1x HIC2 HISILICON 810 HI6280 T:0.12mm
- 1x HIC3 HISILICON 960 HI3660 T: 0.12mm
- 1x HIC4 HISILICON 970 HI3670 T:0.12mm
- 1x HIC5 HISILICON 980 HI3680 T:0.12mm
- 1x HIC6 HISILICON 985 / 820 HI6290/L T:0.12mm
- 1x HIC7 HISILICON 990 HI3690 5G T:0.12mm
- 1x HIC8 UNICORN 990 / 4G HI3690 T:0.12mm
- 1x HIC9 UNICORN 9000 HI36A0 T:0.12mm
- 1x SMC21 SNAPDRAGON 8GEN2 / SM8550 T:0.12mm
- 1x SMC20 SNAPDRAGON 888 / SM8475 T:0.12mm
- 1x SMC19 QUALCOMM MSM8917 T:0.12mm
- 1x SMC18 QUALCOMM MSM8937 / 8940 T:0.12mm
- 1x SMC17 QUALCOMM MSM8916 / 8939 T:0.12mm
- 1x SMC16 QUALCOMM SMS6115 T:0.12mm
- 1x SMC15 QUALCOMM MSM8909 / 8905 T:0.12mm
- 1x SMC14 QUALCOMM SDM636 / 660 T:.12mm
- 1x SMC13 QUALCOMM MSM8953 T:0.12 mm
- 1x SMC12 QUALCOMM MSM8953 IAB T:0.12mm
- 1x SMC11 QUALCOMM MSM8996 T:0.12mm
- 1x SMC10 QUALCOMM SNAPDRAGON 778G / SM7325 T:0.12mm
- 1x SMC9 SNAPDRAGON 780 / 775 / SM7350 T:0.12mm
- 1x SMC8 SNAPDRAGON 888 / SM8350 ANTI SHORT CIRCUIT ISOLATION T:0.12mm
- 1x SMC7 HISILICON 8GEN1 / SM8450 T:0.12mm
- 1x SMC6 SNAPDRAGON 865 SMALL / SM8250 T:0.12mm
- 1x SMC5 SNAPDRAGON 865 BIG / SM8250-002 T:0.12mm
- 1x SMC4 SNAPDRAGON 855 / SM8150 T:0.12mm
- 1x SMC3 SNAPDRAGON 765G / SM 7250 T:0.12mm
- 1x SMC2 SNAPDRAGON 845 / SMD845 T:0.12mm
- 1x SMC1 SNAPDRAGON 888 / SM8350 T:0.12mm