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BOBINA DI RAME 0.01mm 200m FILO JUMP WIRE PER SALDATURE SUNSHINE SS-007D
Price: | €5,30 With VAT |
---|---|
Freight costs: | From € 5,90 With VATDetails |
Item code: | 41671 |
Type of article: | Copper |
Compatible brand: | Universal |
Quality: | Original |
Brand: | Sunshine |
Color: | Manufacturer Standard |
Manifactur Part Number: | SS-007D |
Packaging: | Blister Retail |
Payments: | ![]() |
Unit of measurement: | PZ |
Availability: | Available (4 PZ) |
Quantity: |
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Description
SUNSHINE SS-007D
BOBINA DI RAME 0.01mm 150m FILO JUMP WIRE PER SALDATURE ( For iPhone Chip Conductor Wire)
Filo ultrasottile per lavori di precisione su schede madri Chip IC.
Caratteristiche:
- Materiale di rame importato
- Alta efficienza
- Alta resistenza
- Forte plasticità
- Struttura densa
- Diametro del filo ultra sottile
Spessore: 0.01mm
Lunghezza: 150m
BOBINA DI RAME 0.01mm 150m FILO JUMP WIRE PER SALDATURE ( For iPhone Chip Conductor Wire)
Filo ultrasottile per lavori di precisione su schede madri Chip IC.
Caratteristiche:
- Materiale di rame importato
- Alta efficienza
- Alta resistenza
- Forte plasticità
- Struttura densa
- Diametro del filo ultra sottile
Spessore: 0.01mm
Lunghezza: 150m
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