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STENCIL REBALLING YCS PER LAYER SCHEDA MADRE SAMSUNG S25 / S25+ PLUS
| Price: | €2,20 With VAT |
|---|---|
| Freight costs: | From € 5,90 With VATDetails |
| Item code: | 46590 |
| Type of article: | Template |
| Compatible brand: | Universal |
| Quality: | Original |
| Brand: | YCS |
| Color: | Manufacturer Standard |
| Manifactur Part Number: | YDZSX9140107284 |
| Packaging: | Blister Retail |
| Payments: | 
|
| Unit of measurement: | PZ |
| Availability: | Available (2 PZ) |
| Quantity: |
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Description
STENCIL REBALLING IC CHIP YCS PER LAYER SCHEDA MADRE SAMSUNG S25 / S25+ PLUS
YCS Repairer Samsung S25/S25+ Mid-layer YDZSX9140107284
Questa piattaforma di posizionamento e reballing del layer dei Samusng S25 / S25+ Plus č lo strumento definitivo per la lavorazione delle schede logiche.
Appositamente progettato per lo strato intermedio (mid-layer) della scheda logica.
Rende pių agevole ogni operazione di reballing
Compatibile per BGA
SM-S931B S25 5G (2025)
SM-S931B/DS S25 5G (2025)
SM-S936B S25+ PLUS 5G (2025)
SM-S936B/DS S25+ PLUS 5G (2025)
YCS Repairer Samsung S25/S25+ Mid-layer YDZSX9140107284
Questa piattaforma di posizionamento e reballing del layer dei Samusng S25 / S25+ Plus č lo strumento definitivo per la lavorazione delle schede logiche.
Appositamente progettato per lo strato intermedio (mid-layer) della scheda logica.
Rende pių agevole ogni operazione di reballing
Compatibile per BGA
SM-S931B S25 5G (2025)
SM-S931B/DS S25 5G (2025)
SM-S936B S25+ PLUS 5G (2025)
SM-S936B/DS S25+ PLUS 5G (2025)
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